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rev. 2.0 october 2010 www.aosmd.com page 1 of 12 aoz1361di 28v programmable current-limited load switch general description the aoz1361di is a high-side load switch intended for applications that require circuit protection. the device operates from voltages between 4.5v and 28v. the internal current limiting circui t protects the input supply voltage from large load current. the current limit can be set with an external resistor. the aoz1361di provides thermal protection function that limits excessive power dissipation. the device employs internal soft-start circuitry to control inrush current due to highly capacitive loads associated with hot-plu g events. it features low quiescent current of 220a and the supply current reduces to less than 1a in shutdown. the aoz1361di is available in a 10-pin 4x4 dfn package and can operate over -40 c to +85 c temperature range. features z 35m maximum on resistance z programmable current limit z 4.5v to 28v operating input voltage z low quiescent current z under-voltage lockout z thermal shutdown protection z open-drain fault indicator with delay z small 4x4 dfn package z 2.5kv esd rating applications z notebook pcs z hot swap supplies typical application aoz1361di in in en gnd fltb out out set ss tflt 1 2 6 4 3 10 9 7 5 8 c1 1f c3 1nf c4 1nf on off v out v in c2 0.1f r1 74.5k r2 100k +5v
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 2 of 12 ordering information aos green products use reduced levels of halogens, and are also rohs compliant. please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information. pin configuration pin description part number feature package temperature range environmental aoz1361di-01 auto-restart dfn 4x4 10 -40c to +85c rohs compliant green product AOZ1361DI-02 latch-off pin number pin name pin function 1, 2 in p-channel mosfet source. connect a 1f capacitor from in to gnd. 3 fltb fault output pin. this is an open drain output that is inte rnally pulled low to indicate a fault condition. connect to 5v or 3.3v through a pull up resistor. 4 gnd ground. 5 ss soft-start pin. connect a capacitor from ss to gnd to set the soft-start time. 6 en enable input. 7 set current limit set pin. connect a resistor between set and gnd to set the switch cur- rent limit. 8 tflt fault delay pin. connect a capacitor from tflt to gnd to set the fault delay time. 9, 10 out p-channel mosfet drain. connect a 0.1f capacitor from out to gnd. top view dfn 4 x4 10 in in ss en out 1 2 4 6 9 gnd 3 out 8 set 7 5 10 fltb tflt out gnd
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 3 of 12 absolute maximum ratings exceeding the absolute maximum ratings may damage the device. recommended operating conditions the device is not guaranteed to operate beyond the maximum recommended operating conditions. parameter rating in to gnd -0.3v to +30v en, out to gnd -0.3v to v in + 0.3v fltb, tflt, ss, set -0.3v to +6v maximum junction temperature (t j ) +150c esd rating (hbm) 2.5kv parameter rating thermal resistance (dfn 4x4) 63c/w electrical characteristics v in = 12v, t a = 25c unless otherwise stated. symbol parameter conditions min. typ. max units v in input supply voltage 4.5 28 v v uvlo undervoltage lockout threshold in rising 3.9 4.4 v v uvhys undervoltage lockout hysteresis 200 mv i in_on input quiescent current e n = in, no load 300 500 a i in_off input shutdown current en = gnd, no load 1 a i leak output leakage current en = gnd, no load 1 a r ds(on) switch on resistance v in = 12v 22 35 m ? v in = 4.5v 33 43 i lim current limit r set = 74.5k ? 22.73.4a v en_l enable input low voltage 0.8 v v en_h enable input high voltage 2.0 v v en_hys enable input hysteresis 100 mv i en_bias enable input bias current 1a td_on turn-on delay time en_50% to out_10% r l =120 ? , c l = 1f, ss = floated. measure from 50% of en voltage to 10% of out voltage 280 s t on turn-on rise time out_10% to 90% r l =120 ? , c l = 1f, ss = floated. measure from 10% of out voltage to 90% of out voltage 220 s r l =120 ? , c l = 1f, c ss = 1nf 360 s t off turn-off fall time r l =120 ? , c l = 1f, ss = floated 280 s r ds(fltb) on-resistance at fltb sink current = 4ma 100 ? i leak_flt flt output leakage 1a tflt flt delay period c tlt = 1nf 600 s t sd thermal shutdown threshold 130 c t sd_hys thermal shutdown hysteresis 30 c
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 4 of 12 timing diagram figure 1. aoz1361di timing functional block diagram figure 2. aoz1361di functional block diagram t d(on) 10% 90% t r vih en out vil 90% t d(off) gate driver & slew rate control en in out set aoz1361di 3.9 v uvlo comparator r1 74.5k thermal shutdown c1 1f c4 1nf ss fault delay & latch current limit fltb c3 1nf r2 100 k 5v fltg tflt oc ot
rev. 2.0 october 2010 www.aosmd.com page 5 of 12 aoz1361di functional characteristics turn-on (v in = 12v, r l = 5.6, c4 = 0.01uf) 1ms/div 40ms/div v in 2v/div v out 2v/div en 1v/div i out 0.5a/div turn-off (v in = 12v, r l = 5.6, c4 = 0.01uf) 20s/div v in 2v/div v out 2v/div en 1v/div i out 0.5a/div current limit response thermal shutdown aoz1361di-01: auto-restart version (v in = 12v) v out 5v/div fltb 5v/div i out 2a/div 2ms/div v out 5v/div fltb 5v/div i out 2a/div current limit response thermal shutdown AOZ1361DI-02: latch-off version (v in = 12v)
rev. 2.0 october 2010 www.aosmd.com page 6 of 12 aoz1361di typical operating characteristics input quiescent current 150 200 250 300 350 400 450 51015202530 vin (v) supply current (a) output leakage current (a) input shutdown current vin (v) supply current (a) 85c 25c -40c 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 51015202530 85c 25c -40c output leakage current 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -30 -10 10 30 50 70 90 temperature (c) temperature (c) temperature (c) vin=12v vin=5.5v uvlo threshold vs temperature 3.6 3.65 3.7 3.75 3.8 3.85 3.9 3.95 4.0 -60 -40 -20 0 20 40 60 80 100 120 rising falling rds(on) vs supply voltage 10 12 14 16 18 20 22 24 26 28 30 5 1015202530 vin (v) rds(on) vs temperature 0 5 10 15 20 25 30 35 40 -60 -40 -20 0 20 40 60 80 100 120 vin=12v vin=5.5v threshold (v) rds(on) (m) rds(on) (m)
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 7 of 12 typical operating characteristics (continued) temperature (c) temperature (c) enable input threshold (rising) vs temperature 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -60 -40 -20 0 20 40 60 80 100 120 vin=12v vin=5.5v enable input threshold (falling) vs. temperature 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -60 -40 -20 0 20 40 60 80 100 120 vin=12v vin=5.5v ven (v) ven (v) ambient temperature (c) current (a) current derating curve @ 6a, v in = 12v 4 4.5 5 5.5 6 6.5 0 20 40 60 80 100
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 8 of 12 detailed description introduction the aoz1361di is a 35m ? p-channel high-side load switch with adjustable soft-s tart slew-rate control, programmable current limit and thermal shutdown. it operates with an input voltage range from 4.5v to 28v. enable the en pin is the on/off control for the output switch. the device is enabled when en pin is high and v in is above uvlo. the en pin must be driven to a logic high or logic low state to guarantee operation. while disabled, the aoz1361di only draws about 1a supply current. under-voltage lockout (uvlo) the under-voltage lockout (uvlo) circuit of aoz1361di monitors the input voltage and prevents the output mosfet from turning on until v in exceeds 3.9v. adjustable soft-start slew-rate control when the en pin is asserted high, the slew rate control circuitry applies voltage on the gate of the pmos switch in a manner such that the output voltage and current is ramped up linearly until it reaches the steady-state load current level. the slew rate can be adjusted by an external capacitor connected to the ss pin to ground. the slew rate rise time, ton, can be set using the following equation: programmable current limit the current limit is programmed by an external resistor connected to the set pin to ground. this sets a reference voltage to the current limit error amplifier that compares it to a sensed voltage that is generated by passing a small portion of the load current through an internal amplifier. when the sensed load current exceeds the set current limit, the load current is then clamped at the set limit and the vout drop should be the result of resistance increasing. the ao z1361di will stay in this condition until the load current no longer exceeds the current limit or if the the rmal shutdown protection is engaged. to set the current limit use figure 3 on the following page. thermal shut-down protection the thermal overload prot ection of aoz1361di is engaged to protect the device from damage should the die temperature exceeds safe margins due to a short circuit, extreme loading or heating from external sources. 1. aoz1361di-01 ( auto-restart version): during current limit or short circuit conditions, the pmos resistance is increased to clamp the lo ad current. this increases the power dissipation in the chip causing the die temperature to rise. when the die temperature reaches 130c the thermal shutdown circuitry will shutdown the device. there is a 30c hysterisis. the device will turn back on an d go through soft start after the temperature drops below +100c . the thermal shutdown will cycle r epeatedly until the over temperature condition disappears or the enable pin is pulled low. 2. AOZ1361DI-02 ( latch-off version): thermal shut-down protection sets a fault latch and shuts off the internal mosfet and asserts the fltb output if the junction temperature exceeds +130c. the aoz1361di can be re-enabled by toggling en pin after the die temperature drops below +100c. fltb the fltb pin is an open drain ou tput that is asserted low when either an over-current, short-circuit or over- temperature condition occurs. to prevent false alarm, the aoz1361di implements a fault delay time for over- temperature, over-current and short-circuit fault conditions. the fltb pin bec omes high impedance when the fault conditions are remo ved. for AOZ1361DI-02, if the temperature is higher than +130 c, the device will latch off. after that, if temperature drops below +100c, the fltb pin will pull high, which means the fault condition has already been removed, although there is no output voltage due to latch off function. a pull-up resistor must be connected be tween fltb to 5v or 3.3v to provide a logic signal. tflt tflt is a fault delay pin, and its delay time is adjustable by a capacitor connected from tflt to gnd. the delay time can be calculated by: c tlt ( s) = 600 s / nf x c tflt (nf) ton css v in 30 a -------------------------- =
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 9 of 12 applications information input capacitor selection the input capacitor prevents large voltage transients from appearing at the input, and provides the instantaneous current needed each time the switch turns on and to limit input voltage drop. also it is to prevent high-frequency noise on the power line from passing through the output of the power side. the choice of the input capacitor is based on its ripple current and voltage ratings rather than its capaci tor value. the input capacitor should be located as close to the vin pin as possible. a 1f ceramic cap is recommended. however, higher capacitor values further reduce the voltage drop at the input. output capacitor selection the output capacitor acts in a similar way. a small 0.1f capacitor prevents high-frequency noise from going into the system. also, the output capacitor has to supply enough current for a large load that it may encounter during system transients. this bulk capacitor must be large enough to supply fast transient load in order to prevent the output from dropping. current limit setting the current limit is program by using external resistor connected to the set pin. to set the current limit, use the figure 3 below. figure 3. current limit vs. rset (v in = 12v) slew rate setting slew rate is set by changing the capacitor value on the ss pin of the device. a capaci tor connected between this ss pin and ground will reduce th e output slew-rate. the capacitive range is 0.001f to 0.1f. see figure 4 for output slew rate adjustment vs. capacitance. figure 4. output slew rate adjustment vs. capacitance power dissipation calculation calculate the power dissipation for normal load condition using the following equation: p d = r on x (i out ) 2 the worst case power dissipation occurs when the load current hits the current limit due to over-current or short circuit faults. the power dissipation under these conditions can be calculated using the following equation: p d = (v in ? v out ) x i limit layout guidelines good pcb layout is important for improving the thermal and overall performance of aoz1361. to optimize the switch response time to out put short-circuit conditions keep all traces as short as possible to reduce the effect of unwanted parasitic inductance. place the input and output bypass capacitors as close as possible to the in and out pins. the input and output pcb traces should be as wide as possible for the given pcb space. use a ground plane to enhance the power dissipation capability of the device. aoz1361 rset vs. ilim 1.8 2.8 3.8 4.8 5.8 6.8 15 35 55 75 95 115 ilim (a) rset (k ) 0 5 10 15 20 25 30 35 0 0.02 0.04 0.06 0.08 0.1 capacitance (f) slew rate (ms)
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 10 of 12 package dimensions, dfn 4x4 seating plane b a c 4 6 5 3 2 notes: 1. all dimensions are in millimeters. 2. the dimensions with * are just for reference. 3. the location of the terminal #1 identifier and terminal numbering convention conforms to jedec publication 95 spp-002. 4. dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. if the terminal has the optional radius on the other end of the terminal, then dimension b should not be measured in that radius area. 5. coplanarity applies to the terminals and all other bottom surface metallization. 6. drawings shown are for illustration only. ddd eee b e l e1 d2 a1 a a3 d1 pin #1 ida l1 l3 10x index area (d/2xe/2) chamfer 0.20 unit: mm * l4 l4 * 0.35 typ 0.38 * 6 10 pin 1 d/2 e/2 d e 1 5 5 1 10 6 chamfer 0.20 0.02 pin #1 ida 1.78 1.42 0.30 0.30 2.30 0.65 typ. 0.65 typ. 1.15 3.55 e1/2 l2 top view bottom view side view recommended land pattern symbols a a1 a3 b d d1 d2 d3 d4 e e1 e l l1 l2 l3 l4 aaa bbb ccc ddd eee dimensions in millimeters min. 0.70 0.00 0.30 3.95 1.58 1.22 3.95 2.20 0.50 ? 0.28 nom. 0.75 0.02 0.203 ref 0.35 4.00 1.68 1.32 0.3 ref 0.3 ref 4.00 2.30 0.65 bsc 0.55 0.02 0.38 0.85 ref 0.30 ref 0.15 0.10 0.10 0.08 0.05 max. 0.80 0.05 0.40 4.05 1.78 1.42 4.05 2.40 0.60 0.12 0.48 symbols a a1 a3 b d d1 d2 d3 d4 e e1 e l l1 l2 l3 l4 aaa bbb ccc ddd eee dimensions in inches min. 0.028 0.000 0.012 0.156 0.062 0.048 0.156 0.087 0.020 ? 0.011 nom. 0.030 0.001 0.008 ref 0.014 0.157 0.066 0.052 0.012 ref 0.012 ref 0.157 0.091 0.026 bsc 0.022 0.001 0.015 0.033 ref 0.012 ref 0.006 0.004 0.004 0.003 0.002 max. 0.031 0.002 0.016 0.159 0.070 0.056 0.159 0.094 0.024 0.005 0.019 d3 d4
rev. 2.0 october 2010 www.aosmd.com page 11 of 12 aoz1361di tape and reel dimensions, dfn 4x4 package dfn 4x4 (12mm) a0 b0 k0 e e1 e2 d0 d1 p0 p1 p2 t 4.35 0.10 0.10 1.10 min. 1.50 1.50 +0.1/-0.0 0.3 12.0 0.10 1.75 0.05 5.50 0.10 8.00 0.10 4.00 0.05 2.00 0.05 0.30 r v m n g s w n m ? 79.0 ? 330.0 2.0 12.4 12 mm tape size v r s k 0.5 2.0 10.5 g ??? h w1 ? 13.0 0.5 17.0 h k w w1 reel size ? 330 unit: mm unit: mm 1.0 +2.0/-0.0 +2.6/-0.0 d1 p1 e1 e2 e p2 k0 t a0 p0 b0 d0 c l 0.2 0.10 4.35 carrier tape reel trailer tape 300mm min. or 75 empty pockets components tape orientation in pocket leader tape 500mm min. or 125 empty pockets leader/trailer and orientation feeding direction
aoz1361di rev. 2.0 october 2010 www.aosmd.com page 12 of 12 part marking z1361dix za8r1b part number code assembly lot code fab & assembly location year & week code dfn 4x4 option code as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. alpha & omega semiconductor reserves the right to make changes at any time without notice. life support policy alpha & omega semiconductor products ar e not authorized for use as critical components in life support devices or systems.

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